LED new breakthrough new strong successfully introduced 8-inch epitaxial wafer level packaging technology

According to Taiwan media reports, NeoPac Opto announced that it has successfully developed 8-inch epitaxial wafer-level LEDs package with its NeoPac Universal Platform and sustainable LED s standard light source technology. (WLCSP) technology, which will be used to fabricate ultra-high-brightness LED s illuminating elements (NeoPac Emi tter) in a polycrystalline package with a single point source, and fabricated into a system package with a patented heat dissipation mechanism (System-In-Package) ) LEDs lighting level lighting engine (NeoPac Light Engine).

This LEDs lighting engine for general lighting is scheduled to be officially introduced into mass production in the first half of 2011. The move is expected to push the company's LEDs lighting technology to another level.

WLCSP (Wafer-Level-Chip-Scale-Package) refers to the process of wire bonding, phosphor coating and packaging of LED chips directly on silicon epitaxial wafers.

According to the company, with the current polycrystalline optoelectronic polycrystalline package point source technology, coupled with its patented anti-heating technology, each single package of new glare engine can provide a standard point source that maintains lumens up to 1,000 lumens. The key point is that this is a point source packaging technology suitable for LEDs lighting secondary optical design, and its useful life can be up to 60,000 hours.

This also means that an 8-inch silicon epitaxial package can provide a total output of more than 500,000 lumens. According to the technology development blueprint of the new strong photoelectric sustainability and the luminous efficiency of LEDs, it is estimated that the same 8-inch epitaxial chip-level LEDs package can achieve 1 million lumens of light output after two years. The LEDs lighting developed by this technology has the characteristics of mass production, which will help to greatly reduce the manufacturing cost. LEDs epitaxial wafer-level packaging technology is similar to the already mature DRAM industry, which again announces that LEDs lighting technology will mature.

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