Samsung launches lineup of high-power LED package products for high-intensity lighting applications

Samsung Electronics continues to strengthen its lineup of high-power LED packages with advanced chip packaging technology to provide a wider range of lighting applications and higher performance. LED lighting manufacturers use this range to better optimize luminaire performance, improve lighting quality and efficiency, and greater design flexibility. Samsung offers four main types of high-power LED packages, including: ceramic packages; chip-scale and CSP (chip-scale package) arrays; EMC package (epoxy molding compound) lead frame packages. At present, Samsung's existing high-power LED package products almost fully support all high-intensity light output lighting applications.

Figure: For high-intensity light output lighting applications, Samsung introduced a series of high-power LED package products

Ceramic package

Following the industry-leading level of ceramic high-power packaging, Samsung is expanding its new high-power packaging products, the LH351C and LH351D, which offer 3W to 10W coverage for a wider selection of lighting applications. Samsung's upcoming LH351C and LH351D packages are available in 5W and 10W, respectively, to meet long-term, high-performance lighting needs with high efficiency and reliability. The new ceramic lens kit is optimized for advanced outdoor lighting applications such as street lights, high bay lights and stadium lighting applications.

Chip scale package (CSP)

In addition to the ceramic package series, Samsung uses advanced chip-scale packaging technology to provide LED manufacturers with the industry's best high-power LED lineup with a more compact lighting design. Samsung's LH181A measures 1.91x1.91mm, which is about 30% smaller than Samsung's ceramic LED solution. The ultra-small size of the package also enables greater value and lm/$, which is especially useful in outdoor and spotlighting applications. The LH181A is a 3W high power CSP package that provides high luminous flux (162lm/W, @350mA, Ra70, 5000K). In addition, the use of additional lenses as a secondary optics solution is ideal for street lighting applications.

CSP array

For the Samsung CSP package array products LH204A and LH309A, they are the highest rated in the role of high-power LED solutions, operating power range of 5W to 10W. The LH204A is a 2x2 array of CSPLED chips that provide 12V at 5W operating power, while the LH309A is a 3x3 chip array that provides 26V at 10W operating power. The Samsung CSP array provides high light quality by adhering a single phosphor to an FX (flexible) circuit board on which a small CSP LED chip having a low thermal resistance is disposed. The Samsung CSP array is ideal for spotlight applications that require high light quality from a single source.

EMC (epoxy molding compound) lead frame package

Samsung has also added multi-die LEDs with EMC (epoxy molding compound) packages to its high-power portfolio. With a new package size of 5.0mm x 5.0mm, the new package will enable lighting fixture designers to maximize the cost-effectiveness of outdoor and indoor systems while providing high efficiency performance. It will be launched before the end of 2016. (Compile / Allen Yin)