LED industry continues to face price cuts after entering the lighting era. LED factories are competing to develop unpackaged chips. LED manufacturers Philips Lumileds, Toshiba, TSMC solid-state lighting, crystal and round-free unpackaged chip products have been launched one after another. After the ELC (EmbeddedLEDChip) technology and the PFC (Package FreeChip) debut, Philips Lumileds immediately introduced the high-power LED package components based on the ChipScalePackage technology and the first flip-chip based development. LUXEONQ, unpackaged chip technology is undoubtedly a major focus of the industry in 2013.
As far as the LED lighting products are concerned, the manufacturing process is divided into Level0 to Level5. Among them, Level0 is the process of epitaxial and chip, while Level1 encapsulates the LED chip, Level2 is the LED on the PCB, and Level3 is the LED module. Level 4 is the lighting source and Level 5 is the lighting system. The LED factory has no packaged chip technology and has omitted the development of Level1.
Philips Lumileds' aggressive product line in 2013, in addition to the layout of low-power products, also recently announced the launch of high-power LED package components LUXEONQ, which is the first high-power LED developed by Philips Lumileds based on flip-chip technology. Philips ChipScalePackage (wafer level chip scale package) technology.
Philips Lumileds' latest LUXEONQ uses CSP technology and flip chip technology to achieve high power and high lumen performance. It is understood that Philips Lumileds' previous generation thin-filmflip-chip technology must remove the sapphire substrate in the back-end process, while LUXEONQ uses a new generation Flip-chip technology eliminates the need to remove sapphire substrates in the back-end process. The LUXEONQ lockout directly replaces the already familiar and well-established 3535 series on the market, including patio lights, xenon lamps, exterior wall lights, replacement bulbs and special luminaire applications.
Taiwan LED chip factory is also active in the development of unpackaged chip products. The new ELC product adopts semiconductor manufacturing process, which will save the package (Level1) part, including the past lead frame and wire bonding, leaving only the chip It is used with phosphors and encapsulants, and can be used in direct placement (SMT). It is reported that crystal ELC products have entered the backlight supply chain and will be used in the lighting market in the future.
Yuyuan has also developed PFC package-free products. The chip design based on flipchip does not need to be wired. The advantage of PFC package-free chip products is that the light efficiency is improved to 200lm/W, and the super wide-angle full-period design with illumination angle greater than 300 degrees. In addition, the secondary optical lens can be eliminated, which will reduce the wear and cost of the light effect.
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