According to foreign media reports, Intel plans to adopt a modular structure for the embedded system-on-chip (SoC) products to facilitate the company's low-energy Atom processor to quickly adapt to specific target markets, including smart phones, tablet computers, and microprocessors. The purpose of Intel's move is to promote the development of its low-energy roadmap in the next few years, using Atom chips for smart phones and tablets to compete with ARM mobile processors. At the same time, Intel Atom SoC chips will range from 32nm to 22nm to 14nm over the next three years, and will be named Saltwell, Silvermont and Airmont.
Intel believes that the development of processing technology can not only improve energy efficiency, but also enable more functions to be integrated on the chip. Bill Leszinske, general manager of technology planning at Intel's Atom SoC R&D group, explained that the key part of his strategy is to build a modular structure based on an interconnect called Intel's on-chip system matrix. He said, "Our existing SoC introduced chip-level modular technology that allows users to easily dual-core or quad-core design, but other aspects will depend on the specific market."
This concept is similar to the advanced microcontroller bus architecture commonly used for ARM chips. It mainly simplifies the SoC build process by providing a standard interface to connect reusable functional modules such as I/O, custom logic, and CPU cores.
Leszinske stated that Intel allows the participation of other suppliers in order to integrate more diversified smart assets into SoC design. It also acquired wireless chipset services such as Infineon to provide the necessary technical support for its mobile strategy.
In the next four years, Intel expects to see a 10-fold improvement in graphics and CPU products. Leszinske stated that Intel’s consumer tablet PCs will also be available within the year, and smartphones will be launched in 2012. He stressed that Intel's clear challenge to compete with ARM in the mobile space is high and difficult, but any believe that with Intel's strong strength will bring greater success.
Intel believes that the development of processing technology can not only improve energy efficiency, but also enable more functions to be integrated on the chip. Bill Leszinske, general manager of technology planning at Intel's Atom SoC R&D group, explained that the key part of his strategy is to build a modular structure based on an interconnect called Intel's on-chip system matrix. He said, "Our existing SoC introduced chip-level modular technology that allows users to easily dual-core or quad-core design, but other aspects will depend on the specific market."
This concept is similar to the advanced microcontroller bus architecture commonly used for ARM chips. It mainly simplifies the SoC build process by providing a standard interface to connect reusable functional modules such as I/O, custom logic, and CPU cores.
Leszinske stated that Intel allows the participation of other suppliers in order to integrate more diversified smart assets into SoC design. It also acquired wireless chipset services such as Infineon to provide the necessary technical support for its mobile strategy.
In the next four years, Intel expects to see a 10-fold improvement in graphics and CPU products. Leszinske stated that Intel’s consumer tablet PCs will also be available within the year, and smartphones will be launched in 2012. He stressed that Intel's clear challenge to compete with ARM in the mobile space is high and difficult, but any believe that with Intel's strong strength will bring greater success.
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