Deep interpretation: high power LED package substrate technology

Foreword

Display applications have long been the main appeal of LED lighting components, and LEDs are not required to have high heat dissipation. Therefore, LEDs are mostly packaged directly on conventional resin-based substrates. However, with the development of high-luminance and high efficiency of LEDs since 2000, especially The luminous efficiency of blue LED components has been greatly improved, and liquid crystal, home appliances, automotive and other companies have begun to actively review the applicability of LEDs.

At the same time, the rapid popularization of digital home appliances and flat-panel displays, coupled with the continuous decline in the cost of LEDs, has led to the expanding application of LEDs and the growing scope of LEDs, and the liquid crystal panel manufacturers are facing the dangers of the European Union. RoHS (Restriction of Hazardous Substances Directive), so it is necessary to develop a mercury-based cold cathode fluorescent lamp (CCFL: Cold Cathode Fluorescent Lamp) in the future. The demand is even more urgent.

Technically, high-power LED packaged products have become a very difficult problem in terms of heat dissipation during use. In this context, it is cost-effective, and similar to the development trend of high-heat-dissipation package substrates such as metal-based substrates, and become another device after high-efficiency LEDs. The focus of attention.

Next, this article will introduce the development trend of the metal-based substrate for LED packaging and the heat-dissipation design technology of the ceramic-based package substrate.

development path

Figure 1 is a prediction of the evolution of the application field of LEDs. When high-power LEDs are used as shown in Figure 2, the heat generated by the LEDs is discharged into the air through the package substrate and the cooling fan.

LED application field changes

The necessity of high heat dissipation substrate

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