In 2015, the entire LED industry was a bit unintelligible, and things were sold much more, and the money earned was less. As a result, various products and technologies have been introduced, LD, CSP, NCSP, OLED, flip-chip COB, GaN homogeneous substrate, etc. Even if they can not contribute too much profit, Bobo’s eyeball is good. The LED technology route was once again raised by everyone.
Among them, the most mainstream voice is still flip-chip, which is also a rare consensus in the middle and lower reaches of the LED industry chain. Especially in the current hottest COB and CSP (to be mentioned later), it seems to be inseparable from the reverse. Domestically including Hongli Optoelectronics, Zhonghao Optoelectronics, Guoxing Optoelectronics, Tongfang Optoelectronics, Jingke Electronics, and Xuyu Optoelectronics have all launched their own flip-chip COB products.
"Currently, flip-chip COB is mainly divided into two categories, one is based on small power density, large volume solder paste process; the other is high power density, small volume alloy process." Zheng Xiantao, general manager of Getian Optoelectronics, said Solder paste inverted COB and eutectic flip-chip COB will be the two directions of flip-chip COB polarization in the future, and they will not affect each other, each has its own characteristics and each has its own market.
As a supporter of eutectic flip-chip technology, Getian Optoelectronics has been working on eutectic flip-chip for many years and has achieved many breakthrough patents. “The eutectic flip-chip can maximize the use of the chip and increase its light extraction rate. It can also be more resistant to high temperatures and prolong the service life of the lamp. At the same time, it can also minimize the density of chip arrangement and realize small-volume, high-density light output. ".
Although the industry is still controversial about the problem of eutectic solder paste for flip-chip COB, there is also a preliminary consensus. For low-end and medium- and small-capacity power, solder paste reflow technology is the mainstream. For high-power devices, eutectic is the mainstream. But they all have their own flaws, so although the voice of flipping is very high, the market is cold and has not achieved scale application.
Solder paste reflow soldering technology equipment investment is relatively small, easy to achieve cost control, but the low melting point of solder paste, will lead to many unexpected problems. The most important thing is that the solder paste has a low melting point and the solder paste is easy to produce the problem of creeping. Therefore, the insulation layer of the chip is very demanding, which leads to complicated process of solder paste flip chip process, low yield and difficult chip price. Come down.
Although the eutectic process is very obvious, it can never be the mainstream of LED packaging technology. The main reason is the investment of expensive eutectic equipment. Moreover, the high equipment investment can only have a very low output. Both the substrate and the chip need a thick gold and precious metal, which leads to higher cost and low cost performance, and does not have much market competitiveness.
In addition to the high equipment investment in the previous period, the chip and aluminum nitride ceramic substrate required for eutectic flip-chip (can only be imported from Taiwan), due to the narrow supply surface, resulting in high unit price and long cycle, it is also difficult to price the eutectic flip chip. The main cause of control.
“From the perspective of the application market, eutectic flip-chip COB is used in outdoor high-power lighting fixtures, which has the advantage that the solder paste flip-chip COB can't match. However, due to the narrow market, there are not many companies that are really involved in eutectic flip-chip COB.†Zheng Xiantao said that Getian Optoelectronic's eutectic flip-chip COB has begun to take shape, in addition to outdoor high-power lighting, it can also be used in stage lights and other occasions.
Nevertheless, the advantages of eutectic are obvious to all. The key is that there is still a lot of room for price reduction, but this is based on the integrity of the industry chain. "Only if we cultivate together, we can promote the improvement of the entire eutectic flip-chip COB industry chain, so that it can greatly enhance its market recognition and product cost performance, and form a scale-based promotion." Zheng Xiantao said.
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